How to do BGA Assembly?

Our SMT manufacturing team has rich experience in handling all types of BGAs and have excellent capacity to place them onto your PCB boards with good connection and appearance. Read on to more about our BGA Assembly Capacity as following:

• DSBGA and other complex components

• BGAs with size 2mm x3mm

• BGAs with large size reaching 45mm

• Ceramic BGAs

• Plastic BGAs

• BGAs with minimum 0.4mm pitch

Hereafter contents is helpful to know how to do BGA Assembly Process. Thermal profile, meaning temperature control, which is the most important for BGA in the PCB Assembly process. Our SMT production team will conduct a careful DGM Check to review your PCB Gerber files and the BGA datasheet to optimize the thermal profile for the BGA assembly. Taking BGA size and BGA ball material composition type into consideration, then to make effective temperature control. If the BGA size is large, we will optimize the thermal profile localize the heating on the internal BGA to prevent joint voids and other Common PCB Assembly Faults. We follow the IPC Class 2 or Class 3 Quality Management guidelines to make sure any voids are under 25% of the total solder ball diameter. BGAs will go through a specialized lead-free thermal profile to avoid open ball problems that can result from the lower temperatures, and to prevent higher temperatures from causing pin shorts.

When we receive your Turnkey PCB Assembly Order, we will check your PCB design to review any considerations specific to BGA components during DFM (Design for Manufacturability) review. The full verification includes checks for the PCB Laminate Material compatibility, Surface Finish effects, maximum warpage requirement and Soldermask clearance. All these factors affect the quality of BGA assembly.

Features of BGA Assembly Services

The following features will help you understand the BGA assembly process at KFPCBA:

• The process starts with the development of thermal profile by our experts as it is one of the most important processes in BGA assembly. We review the BGA datasheet and the PCB files provided by you to create a suitable thermal profile for your BGA assembly.

• We always keep voids under 25% of the solder ball diameter. This is in adherence to IPC Class II or Class III quality guidelines.

• Specialized thermal profiles are designed for leaded or lead-free BGAs to prevent higher temperatures or avoid open ball problems.

• We conduct a detailed Design for Manufacturability (DFM) review to ensure the appropriateness. This includes checking maximum warpage, surface finishes, solder mask clearances, and more.

• We provide BGA soldering, reballing, and BGA rework services at competitive prices.

Beneficial Features of BGA Assemblies

Over the years, BGA packages have gained immense popularity owing to the following advantages:

• Reduced Package Sizes: With miniaturization becoming a key trend, BGAs have allowed PCB assembly services like us to fulfill customer demands for miniature devices. These packages allow us to integrate various functions on a chip module by providing several interconnection pins. Leads follow shorter paths, which helps ensure excellent performance at high speeds.

• Better Thermal Profiles: BGA packages have better thermal profiles than other packages because they have low thermal resistance. This helps the heat produced by integrated circuits to dissipate easily, thereby preventing the chips to heating.

• Superior Electrical Performance: These packages have shorter leads, which means they have low lead inductances. This low lead inductance ensures excellent electrical performance in high speed circuit boards. Inductance is the property that generates unwanted signal distortion in high-speed electronics applications.

At KFPCBA, we value quality and customer satisfaction above anything else. We source the materials from trusted suppliers, and employ only proven manufacturing and assembly technologies, which helps us stay true to our commitment. To receive a quote for BGA assembly order or rework, soldering, or reballing, please contact us at the earliest.

BGA Soldering, Reballing and Rework

Your PCB design may only have a few BGAs or fine pitch components which require PCB Assembly Prototyping for research and development purpose. We can help in this stage, and we provide specialized BGA soldering service for testing and evaluation purposes because it is a part of our focus on Prototype PCB Assembly. What’s more, we can do actual assistance with BGA reballing and BGA rework at low cost. If your BGA component on PCBA goes something problem, we can conduct the BGA rework following such 5 basic steps: BGA component removal, SMT pads preparation, solder paste application through a small BGA stencil, BGA replacement, and Reflow Soldering.

X-ray Inspection on BGA Assembly

X-ray inspection is the best method to detect BGA assembly defects. Though X-ray inspection, we can eliminate soldering problems on PCB board, such as Solder Balls and Paste Bridging. Also, the X-ray support software can calculate the gap size in the ball to make sure it follows IPC class 2 or Class 3 standards, as per your requirement. If in demand, we can send you the X-ray inspection photos.

If want to send an inquiry, please Contact Us at any time.